Data processing device

ABSTRACT

A novel human interface with excellent operability is provided. A novel data processing device with excellent operability is provided. A novel data processing device, a novel display device, or the like is provided. An input and output device is supplied with image data and supplies sensing data, and an arithmetic device supplies the image data and is supplied with the sensing data. The input and output device includes a plurality of display portions that display display data and a sensing portion that senses an object obscuring one of the display portions, and includes one region provided with the one of the display portions and the sensing portion, another region provided with the other display portions, and a curved portion between the one region and the other region. The arithmetic device includes an arithmetic portion and a memory portion that stores a program to be executed by the arithmetic portion.

BACKGROUND OF THE INVENTION 1. Field of the Invention

One embodiment of the present invention relates to a method and aprogram for processing and displaying image information, and a deviceincluding a storage medium in which the program is stored. Inparticular, one embodiment of the present invention relates to a methodfor processing and displaying image data by which an image includinginformation processed by a data processing device provided with adisplay portion is displayed, a program for displaying an imageincluding information processed by a data processing device providedwith a display portion, and a data processing device including a storagemedium in which the program is stored.

Note that one embodiment of the present invention is not limited to theabove technical field. The technical field of one embodiment of theinvention disclosed in this specification and the like relates to anobject, a method, or a manufacturing method. In addition, one embodimentof the present invention relates to a process, a machine, manufacture,or a composition of matter. Specifically, examples of the technicalfield of one embodiment of the present invention disclosed in thisspecification include a semiconductor device, a display device, alight-emitting device, a power storage device, a memory device, a methodfor driving any of them, and a method for manufacturing any of them.

2. Description of the Related Art

The social infrastructures relating to means for transmittinginformation have advanced. This has made it possible to acquire,process, and send out many pieces and various kinds of information withthe use of a data processing device not only at home or office but alsoat other visiting places.

With this being the situation, portable data processing devices areunder active development.

Portable data processing devices are often used while being carriedaround, and force might be accidentally applied, by dropping forexample, to the data processing devices and to display devices includedin them. As an example of a display device that is not easily broken, adisplay device having high adhesiveness between a structure body bywhich a light-emitting layer is divided and a second electrode layer isknown (Patent Document 1).

For example, a cellular phone is known in which a display device isprovided on a front side and on an upper side in the longitudinaldirection of a housing (Patent Document 2).

Patent Documents

[Patent Document 1] Japanese Published Patent Application No.2012-190794

[Patent Document 2] Japanese Published Patent Application No.2010-153813

SUMMARY OF THE INVENTION

An object of one embodiment of the present invention is to provide anovel human interface with excellent operability. Another object is toprovide a novel data processing device with excellent operability.Another object is to provide a novel data processing device, a noveldisplay device, or the like.

Note that the descriptions of these objects do not disturb the existenceof other objects. Note that in one embodiment of the present invention,there is no need to achieve all the objects. Note that other objectswill be apparent from and can be derived from the description of thespecification, the drawings, the claims, and the like.

One embodiment of the present invention is a data processing deviceincluding an input and output device supplied with first image data andsecond image data and capable of supplying first sensing data, and anarithmetic device capable of supplying the first image data and thesecond image data and supplied with the first sensing data.

The input and output device includes a first display portion suppliedwith and capable of displaying the first image data, a second displayportion supplied with and capable of displaying the second image data, afirst sensing portion capable of sensing an object obscuring the firstdisplay portion and supplying the first sensing data, a first regionprovided with the first display portion, a second region provided withthe second display portion, and a first curved portion between the firstregion and the second region.

The arithmetic device includes an arithmetic portion and a memoryportion capable of storing a program to be executed by the arithmeticportion. The arithmetic portion is capable of generating the first imagedata or the second image data based on the first sensing data.

The above-described data processing device of one embodiment of thepresent invention includes the input and output device supplied withimage data and capable of supplying sensing data, and the arithmeticdevice capable of supplying the image data and supplied with the sensingdata. The input and output device includes a plurality of displayportions capable of displaying display data and a sensing portioncapable of sensing an object obscuring one of the plurality of displayportions, and includes one region provided with the one of the pluralityof display portions and the sensing portion, another region providedwith the other display portions, and a curved portion between the oneregion and the other region. The arithmetic device includes thearithmetic portion and the memory portion capable of storing a programto be executed by the arithmetic portion. Thus, image data based onsensing data supplied from the one region can be generated and displayedon the one region and/or the other region. Consequently, a novel dataprocessing device can be provided.

In the above-described data processing device of one embodiment of thepresent invention, the input and output device may include a secondsensing portion capable of sensing an object obscuring the seconddisplay portion and supplying second sensing data. The arithmetic deviceis supplied with the second sensing data. The arithmetic portion iscapable of generating the first image data and/or the second image databased on the first sensing data and/or the second sensing data.

In the above-described structure, the above-described data processingdevice of one embodiment of the present invention may include the seconddisplay portion, the second sensing portion capable of sensing an objectobscuring the second display portion, and the second region providedwith the second display portion and the second sensing portion. Thus,image data based on sensing data supplied from one of the regions can begenerated and displayed by the input and output device. Consequently, anovel data processing device can be provided.

In the above-described data processing device of one embodiment of thepresent invention, the first region can be folded or unfolded.

The data processing device of one embodiment of the present inventionincludes the first region which can be folded or unfolded. Accordingly,the data processing device can be used with the first region having ahighly portable size or a highly browsable size. Consequently, a noveldata processing device can be provided.

Another embodiment of the present invention is a data processing deviceincluding an input and output device supplied with first image data andsecond image data and capable of supplying first sensing data, and anarithmetic device capable of supplying the first image data and thesecond image data and supplied with the first sensing data.

The input and output device includes a terminal supplied with the firstimage data and the second image data, a first display portion suppliedwith and capable of displaying the first image data, a second displayportion supplied with and capable of displaying the second image data, afirst sensing portion capable of sensing an object obscuring the firstdisplay portion and supplying the first sensing data, a first regionprovided with the first display portion, a second region provided withthe second display portion, a third region provided with the terminal, afirst curved portion between the first region and the second region, anda second curved portion between the first region and the third region.The third region is capable of supplying the first image data and thesecond image data. The first region is supplied with the first imagedata and the second image data and is capable of supplying the secondimage data. The second region is supplied with the second image data.

In the data processing device, an arithmetic portion is capable ofgenerating the first image data or the second image data based on thefirst sensing data.

The above-described data processing device of one embodiment of thepresent invention includes the first region provided with the firstdisplay portion, the second region provided with the second displayportion, the third region provided with the terminal, the first curvedportion between the first region and the second region, and the secondcurved portion between the first region and the third region.Accordingly, the terminal is capable of supplying the first image dataand the second image data. The first region is capable of displaying thefirst image data and supplying the second image data, and the secondregion is capable of displaying the second image data. Consequently, anovel data processing device can be provided.

In the above-described data processing device of one embodiment of thepresent invention, the input and output device may be capable ofsupplying first positional data and second positional data. Thearithmetic device may be supplied with the first positional data and thesecond positional data. The input and output device may include a firstpositional data input portion capable of supplying the first positionaldata and a second positional data input portion capable of supplying thesecond positional data. The first region may include the firstpositional data input portion overlapping with the first displayportion. The second region may include the second positional data inputportion overlapping with the second display portion.

In the above-described data processing device of one embodiment of thepresent invention, the first region includes the first positional datainput portion overlapping with the first display portion, and the secondregion includes the second positional data input portion overlappingwith the second display portion. Accordingly, image data based onpositional data supplied from one data input portion can be generatedand displayed on the first display portion or the second displayportion. Consequently, a novel data processing device can be provided.

Another embodiment of the present invention is the above-described dataprocessing device with a program including a first step of acquiringinitial data including status data; a second step of allowing aninterrupt processing; a third step of acquiring predetermined data; afourth step of selecting a fifth step when the status data shows a firststatus or a sixth step when the status data shows a second status; thefifth step of generating first image data based on the predetermineddata and displaying the first image data on the first display portion;the sixth step of generating second image data based on thepredetermined data and displaying the second image data on the seconddisplay portion; a seventh step of selecting an eighth step when atermination instruction is supplied in the interrupt processing or thethird step when no termination instruction is supplied in the interruptprocessing; and the eighth step of terminating the program.

The interrupt processing includes a ninth step of acquiring firstsensing data and second sensing data; a tenth step of determiningcandidate data based on the first sensing data and the second sensingdata; an eleventh step of selecting a twelfth step when the candidatedata differs from the status data or the ninth step when the candidatedata is the same as the status data; the twelfth step of updating thestatus data with the candidate data; and a thirteenth step of returningfrom the interrupt processing.

In the above-described data processing device of one embodiment of thepresent invention, the program includes the step of determiningcandidate data by acquiring the first sensing data and the secondsensing data; the step of updating the status data with the candidatedata when the status data differs from the candidate data; and the stepof generating and displaying image data including predetermined databased on the updated status data. Thus, an image including thepredetermined data which is based on the status data can be generatedand displayed on a predetermined region. Consequently, a novel dataprocessing device can be provided.

According to one embodiment of the present invention, a novel humaninterface with excellent operability can be provided. A novel dataprocessing device with excellent operability can be provided. A noveldata processing device, a novel display device, or the like can beprovided. Note that the description of these effects does not disturbthe existence of other effects. One embodiment of the present inventiondoes not necessarily achieve all the above effects. Other effects willbe apparent from and can be derived from the description of thespecification, the drawings, the claims, and the like.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram illustrating a structure of a data processingdevice of an embodiment.

FIGS. 2A, 2B, 2C1, 2C2, and 2D are schematic diagrams illustrating astructure of a data processing device of an embodiment.

FIGS. 3A1, 3A2, 3A3, 3B, and 3C are schematic diagrams illustrating astructure of a data processing device of an embodiment.

FIG. 4 is a block diagram illustrating a structure of a data processingdevice of an embodiment.

FIGS. 5A1, 5A2, 5B, 5C, and 5D are schematic diagrams illustrating astructure of a data processing device of an embodiment.

FIGS. 6A1, 6A2, 6B1, and 6B2 are schematic diagrams illustrating astructure of a data processing device of an embodiment.

FIG. 7 is a flowchart illustrating a program stored in a memory portionof a data processing device of an embodiment.

FIG. 8 is a flowchart illustrating a program stored in a memory portionof a data processing device of an embodiment.

FIGS. 9A to 9C illustrate a structure of a touch panel that can be usedin a data processing device of an embodiment.

FIGS. 10A and 10B illustrate a structure of a touch panel that can beused in a data processing device of an embodiment.

FIGS. 11A to 11C each illustrate a structure of a touch panel that canbe used in a data processing device of an embodiment.

FIGS. 12A to 12C each illustrate a structure of a touch panel that canbe used in a data processing device of an embodiment.

FIGS. 13A to 13D illustrate a method for manufacturing a bendable orfoldable device of an embodiment.

FIGS. 14A to 14D illustrate a method for manufacturing a bendable orfoldable device of an embodiment.

FIGS. 15A to 15D illustrate a method for manufacturing a bendable orfoldable device of an embodiment.

DETAILED DESCRIPTION OF THE INVENTION

A data processing device of one embodiment of the present inventionincludes an input and output device supplied with image data and capableof supplying sensing data, and an arithmetic device capable of supplyingthe image data and supplied with the sensing data. The input and outputdevice includes a plurality of display portions capable of displayingdisplay data and a sensing portion capable of sensing an objectobscuring one of the plurality of display portions, and includes oneregion provided with the one of the display portions and the sensingportion, another region provided with the other display portions, and acurved portion between the one region and the other region. Thearithmetic device includes an arithmetic portion and a memory portioncapable of storing a program to be executed by the arithmetic portion.

Thus, image data based on sensing data supplied from a first region canbe generated and displayed on the first region and/or a second region.As a result, a novel human interface with excellent operability can beprovided. A novel data processing device with excellent operability canbe provided. A novel data processing device, a novel display device, orthe like can be provided.

Embodiments will be described in detail with reference to the drawings.Note that the present invention is not limited to the followingdescription, and it will be easily understood by those skilled in theart that various changes and modifications can be made without departingfrom the spirit and scope of the present invention. Therefore, thepresent invention should not be construed as being limited to thedescription in the following embodiments. Note that in the structures ofthe invention described below, the same portions or portions havingsimilar functions are denoted by the same reference numerals indifferent drawings, and description of such portions is not repeated.

Embodiment 1

In this embodiment, a structure of a data processing device of oneembodiment of the present invention will be described with reference toFIG. 1 and FIGS. 2A, 2B, 2C1, 2C2, and 2D.

FIG. 1 is a block diagram illustrating a structure of a data processingdevice 100 of one embodiment of the present invention.

FIG. 2A is a schematic diagram illustrating the appearance of the dataprocessing device 100 of one embodiment of the present invention, andFIG. 2B is a cross-sectional view illustrating a cross-sectionalstructure along a cutting-plane line X1-X2 in FIG. 2A.

FIG. 2C1 is a schematic diagram illustrating the appearance of apositional data input portion and a display portion which can be used inthe data processing device 100.

FIG. 2C2 is a schematic diagram illustrating the appearance of aproximity sensor 142 which can be used in the positional data inputportion.

FIG. 2D is a cross-sectional view illustrating a cross-sectionalstructure of the proximity sensor 142 along a cutting-plane line X3-X4in FIG. 2C2.

Example 1 of Structure of Data Processing Device

The data processing device 100 described in this embodiment includes aninput and output device 120 that is supplied with first image data V1and second image data V2 and supplies first sensing data S1, and anarithmetic device 110 that supplies the first image data V1 and thesecond image data V2 and is supplied with the first sensing data S1 (seeFIG. 1 ).

The input and output device 120 includes a first display portion 130(1)that is supplied with and displays the first image data V1, a seconddisplay portion 130(2) that is supplied with and displays the secondimage data V2, and a first sensing portion 150(1) that senses an objectobscuring the first display portion 130(1) and supplies the firstsensing data S1. The input and output device 120 also includes a firstregion 120(1) provided with the first display portion 130(1) and thefirst sensing portion 150(1), a second region 120(2) provided with thesecond display portion 130(2), and a first curved portion 120 c(1)between the first region 120(1) and the second region 120(2) (see FIG. 1and FIGS. 2A and 2B).

The arithmetic device 110 includes an arithmetic portion 111 and amemory portion 112 that stores a program to be executed by thearithmetic portion 111. The arithmetic portion 111 generates the firstimage data V1 or the second image data V2 based on the first sensingdata S1 (see FIG. 1 ).

The above-described data processing device of one embodiment of thepresent invention includes the input and output device 120 that issupplied with image data and supplies sensing data, and the arithmeticdevice 110 that supplies the image data and is supplied with the sensingdata. The input and output device 120 includes a plurality of displayportions that display display data and a sensing portion that senses anobject obscuring one of the display portions, and includes one regionprovided with the one of the display portions and the sensing portion,another region provided with the other display portions, and a curvedportion between the one region and the other region. The arithmeticdevice includes an arithmetic portion and a memory portion that stores aprogram to be executed by the arithmetic portion. Thus, image data basedon sensing data supplied from the one region can be generated anddisplayed on the one region and/or the other region. Consequently, anovel data processing device can be provided.

The input and output device 120 may be configured to supply firstpositional data L1 and second positional data L2, and the arithmeticdevice 110 may be configured to be supplied with the first positionaldata L1 and the second positional data L2 (see FIG. 1 ).

The input and output device 120 may include a positional data inputportion 140 capable of supplying positional data. For example, the firstregion 120(1) may include a first positional data input portion 140(1)overlapping with the first display portion 130(1), and the second region120(2) may include a second positional data input portion 140(2)overlapping with the second display portion 130(2).

The first positional data input portion 140(1) may be configured tosupply the first positional data L1, and the second positional datainput portion 140(2) may be configured to supply the second positionaldata L2.

The data processing device 100 described in this embodiment as anexample can generate image data based on positional data supplied fromthe positional data input portion and display it on the first displayportion or the second display portion. Consequently, a novel dataprocessing device can be provided.

The input and output device 120 may include an input and output portion145 that supplies and is supplied with data and a communication portion160 that supplies and is supplied with communication data COM.

The arithmetic device 110 may include a transmission path 114 thatsupplies and is supplied with data, and an input and output interface115 that supplies and is supplied with data.

Individual components included in the data processing device aredescribed below. Note that these portions cannot be clearlydistinguished and one portion also serves as another portion or includespart of another portion in some cases.

For example, a touch panel in which a display portion overlaps with atouch sensor serves as the positional data input portion 140 as well asa display portion 130.

Note that although this embodiment describes a touch sensor having astructure where the positional data input portion 140 is placed on adisplay surface side of the display portion 130 as an example, oneembodiment of the present invention is not limited to this structure.Specifically, the display portion 130 may be placed on a sensing surfaceside of the positional data input portion 140, or the display portion130 and the positional data input portion 140 may be integrated into oneunit. In other words, either an on-cell touch panel or an in-cell touchpanel may be employed.

Entire Structure

The data processing device 100 includes the input and output device 120and the arithmetic device 110 (see FIG. 1 ).

Input and Output Device

The input and output device 120 includes the display portion 130 and asensing portion 150. The input and output device 120 is supplied withthe first image data V1 and the second image data V2 and supplies thefirst sensing data S1 and the second sensing data S2.

The input and output device 120 may include the positional data inputportion 140, the input and output portion 145, and the communicationportion 160.

The input and output device 120 includes the first region 120(1), thesecond region 120(2), the first curved portion 120 c(1), and a secondcurved portion 120 c(2) (see FIGS. 2A and 2B).

Curved Portion

A portion showing the most significant change in curvature between thefirst region 120(1) and the second region 120(2) is referred to as thefirst curved portion 120 c(1). In the case where the input and outputdevice 120 has a curved surface that includes the first region 120(1)and the second region 120(2), and the first region 120(1) and the secondregion 120(2) are continuous, for example, the first curved portion 120c(1) includes a portion with the smallest curvature radius that appearsin a section of the curved surface. The curvature radius of the curvedportion is 10 mm or less, preferably 8 mm or less, further preferably 5mm or less, particularly preferably 4 mm or less.

The first curved portion 120 c(1) and/or the second curved portion 120c(2) may have a display portion and a positional data input portion thatoverlaps with the display portion. With such a structure, positionaldata supplied from the first curved portion 120 c(1) and/or the secondcurved portion 120 c(2) may be used instead of the second positionaldata L2.

First Region

The first region 120(1) includes the first display portion 130(1) andthe first sensing portion 150(1).

The first region 120(1) may include the first positional data inputportion 140(1).

Second Region

The second region 120(2) includes the second display portion 130(2).

The second region 120(2) may also include the second positional datainput portion 140(2) and/or a second sensing portion 150(2) that sensesan object obscuring the second region.

Although the example in which the input and output device 120 has twosecond regions 120(2) is shown in FIG. 2B, one embodiment of the presentinvention is not limited to this example. The input and output device120 may have only one second region 120(2), or three or more secondregions 120(2).

For example, two second regions 120(2) may be arranged to face eachother (see FIG. 2B). The distance between the two second regions 120(2)is, for example, 17 cm or shorter, preferably 9 cm or shorter, furtherpreferably 7 cm or shorter. When the distance is short, the thumb of theholding hand can be used to obtain positional data in a large area ofthe first positional data input portion 140(1).

Display Portion

There is no particular limitation on the display portion 130 as long asthe display portion 130 can display supplied image data (see FIG. 2C1 ).

The display portion 130 includes the first display portion 130(1) andthe second display portion 130(2).

The first display portion 130(1) displays the first image data V1 thatis supplied thereto, and the second display portion 130(2) displays thesecond image data V2 that is supplied thereto.

The first display portion 130(1) and the second display portion 130(2)may be driven as one display portion. For example, one driver circuitmay supply signals to select scan lines.

The first display portion 130(1) and the second display portion 130(2)may be driven as different display portions. For example, separatedriver circuits may be provided for the display portions, and the drivercircuits may supply signals to select scan lines to the correspondingdisplay portions.

For example, when the data processing device 100 is in a standby state,only the second display portion 130(2) may be driven, and drive of thefirst display portion 130(1) may be stopped. Stopping drive of the firstdisplay portion 130(1) can reduce power consumption.

Note that a flexible display portion which can be bent at a positionoverlapping with the first curved portion 120 c(1) can be used as thedisplay portion 130. Specific examples of structures that can beemployed in the display portion 130 are described in Embodiments 4 to 6.

Sensing Portion

The sensing portion 150 senses the states of the data processing device100 and the circumstances and supplies sensing data (see FIG. 1 ).

The sensing portion 150 includes the first sensing portion 150(1), andthe first sensing portion senses an object obscuring the first displayportion 130(1). Then, the first sensing portion 150(1) supplies thefirst sensing data S1 including data about whether the first displayportion 130(1) is obscured or not.

For example, any of a variety of sensing elements such as aphotoelectric conversion element, an imaging element, a magnetic sensor,and a proximity sensor can be used in the first sensing portion 150(1).

Specifically, a photoelectric conversion element 150PD is provided inthe first region 120(1) so as to sense the intensity of light incidentfrom a side where the first display portion 130(1) displays image data(see FIG. 2A).

This enables the photoelectric conversion element 150PD to sense thatthe first region is covered with a protective case or cover for the dataprocessing device 100, clothes, or the like.

Note that the first sensing portion 150(1) is not necessarily providedin the first region 120(1) and may be provided in another place as longas the first sensing portion 150(1) can sense an object obscuring thefirst display portion 130(1). For example, the first sensing portion150(1) may be provided in the second region, or data supplied fromanother device may be used as the first sensing data S1.

Specifically, a sensing element capable of sensing a much wider rangewith use of a fish-eye lens may be provided in the second region andused as the first sensing portion 150(1). Alternatively, an image takenby a monitoring camera may be obtained through a communication networkand used as the first sensing data S1.

Note that the sensing portion 150 may sense acceleration, a direction,pressure, a global positioning system (GPS) signal, temperature,humidity, or the like and supply data thereon.

Positional Data Input Portion

The positional data input portion 140 senses an approaching object andsupplies positional data of the approaching object to the arithmeticdevice 110. Note that when the positional data input portion 140 ispositioned closer to the user than the display portion 130 is, thepositional data input portion 140 has a light-transmitting property.

For example, the user of the data processing device 100 can give avariety of operating instructions to the data processing device 100 bymaking his/her finger, palm, or the like in proximity to the positionaldata input portion 140. For example, an operating instruction includinga termination instruction (an instruction to terminate the program) canbe supplied.

For example, the proximity sensors 142 may be arranged in a matrix overa flexible substrate 141 to constitute the positional data input portion140 (seeFIGS. 2C1, 2C2, and 2D).

The positional data input portion 140 includes the first positional datainput portion 140(1) and the second positional data input portion140(2).

The first positional data input portion 140(1) supplies the firstpositional data L1, and the second positional data input portion 140(2)supplies the second positional data L2.

The first positional data input portion 140(1) and the second positionaldata input portion 140(2) may be driven as one positional data inputportion.

The positional data input portion 140 may be divided into the firstpositional data input portion 140(1) and the second positional datainput portion 140(2) which are partially driven. In other words, thesecond positional data input portion 140(2) may be driven independentlyof the first positional data input portion 140(1).

Here, X1-X2 direction is set as a row direction, and the directioncrossing the row direction is set as a column direction. A plurality ofscan lines extending in the row direction so as to cross the firstpositional data input portion 140(1) and the second positional datainput portion 140(2), a plurality of signal lines extending in thecolumn direction, and the proximity sensors 142 each electricallyconnected to one scan line and one signal line are provided in a matrix.

The positional data input portion 140 may be partially driven in thefollowing manner: a proximity sensor connected to a first signal lineprovided in the first positional data input portion 140(1) and aproximity sensor connected to a second signal line provided in thesecond positional data input portion 140(2) are driven independently ofeach other.

Specifically, when only the first positional data input portion 140(1)is used, only the proximity sensor provided in the first positional datainput portion 140(1) and connected to the first signal line is driven.

Specifically, when only the second positional data input portion 140(2)is used, only the proximity sensor provided in the second positionaldata input portion 140(2) and connected to the second signal line isdriven.

Note that the scan line is shared by the first positional data inputportion 140(1) and the second positional data input portion 140(2);thus, the proximity sensor provided in the first positional data inputportion 140(1) and the proximity sensor provided in the secondpositional data input portion 140(2) are driven at different times.

For example, in the case where the data processing device 100 is usedwith its housing 101 being held by the user's hand, only the firstpositional data input portion 140(1) may be driven and drive of thesecond positional data input portion 140(2) may be stopped. Stoppingdrive of the second positional data input portion 140(2) can reducemalfunctions due to the second positional data L2 supplied from thesecond positional data input portion 140(2) as a result of sensing thehand holding the data processing device 100.

For example, in the case where the sum of power consumed by the firstpositional data input portion 140(1) and power consumed by the secondpositional data input portion 140(2) is larger than power consumed bythe first positional data input portion 140(1), only the secondpositional data input portion 140(2) may be driven and drive of thefirst positional data input portion 140(1) may be stopped in a standbystate of the data processing device 100. Stopping drive of the firstpositional data input portion 140(1) can reduce power consumption.

The proximity sensor 142 senses proximity or touch of an object (e.g., afinger or a palm), and a capacitor or an imaging element can be used asthe proximity sensor. Note that a substrate provided with capacitorsarranged in a matrix can be referred to as a capacitive touch sensor,and a substrate provided with an imaging element can be referred to asan optical touch sensor.

For the flexible substrate 141, a resin that is thin enough to haveflexibility can be used. Specific examples of the resin include apolyester, a polyolefin, a polyamide (such as a nylon or an aramid), apolyimide, a polycarbonate, and an acrylic resin.

Additionally, as a normal non-flexible substrate, a glass substrate, aquartz substrate, a semiconductor substrate, or the like can be used.

Note that a flexible positional data input portion which can be bent ata position overlapping with the first curved portion 120 c(1) can beused as the positional data input portion 140. Specific examples ofstructures that can be employed in the positional data input portion 140are described in Embodiments 4 to 6.

Communication Portion

The communication portion 160 supplies the data COM supplied by thearithmetic device 110 to a device or a communication network outside thedata processing device 100. Furthermore, the communication portion 160acquires the data COM from the device or communication network outsidethe data processing device 100 and supplies the data COM.

The data COM can include a variety of instructions or the like inaddition to audio data, image data, and the like. For example, the dataCOM can include an operating instruction to make the arithmetic portion111 generate or delete the first image data V1 and the second image dataV2.

A communication unit for connection to the external device or externalcommunication network, e.g., a hub, a router, or a modem, can be usedfor the communication portion 160. Note that the connection method isnot limited to a method using a wire, and a wireless method (e.g., radiowave or infrared rays) may be used.

Input and Output Portion

As the input and output portion 145, for example, a camera, amicrophone, a read-only external memory portion, an external memoryportion, a scanner, a speaker, or a printer can be used (see FIG. 1 ).

Specifically, as the camera, a digital camera, a digital video camera,or the like can be used.

As the external memory portion, a hard disk, a removable memory, or thelike can be used. As the read-only external memory portion, a CD-ROM, aDVD-ROM, or the like can be used.

Arithmetic Device

The arithmetic device 110 includes the arithmetic portion 111 and thememory portion 112. The arithmetic device 110 supplies the first imagedata V1 and the second image data V2 and is supplied with the firstsensing data S1 and the second sensing data S2 (see FIG. 1 ).

For example, the arithmetic device 110 supplies the first image data V1and the second image data V2 including an image used for operation ofthe data processing device 100.

Note that the first image data V1 is displayed on the first displayportion 130(1), and the second image data V2 is displayed on the seconddisplay portion 130(2).

The arithmetic device 110 may be configured to be supplied with thefirst positional data L1 and the second positional data L2. For example,by touching a position of the first positional data input portion 140(1)overlapping with the image used for operation, which is displayed on thefirst display portion 130(1), with a finger or the like, the user of thedata processing device 100 can supply an operating instructionassociated with the image to the arithmetic device 110. Similarly, bytouching a position of the second positional data input portion 140(2)overlapping with the image used for operation, which is displayed on thesecond display portion 130(2), with a finger or the like, the user ofthe data processing device 100 can supply an operating instructionassociated with the image to the arithmetic device 110.

The arithmetic device 110 may further include the transmission path 114and the input and output interface 115.

Arithmetic Portion

The arithmetic portion 111 executes the program stored in the memoryportion 112. For example, in response to supply of positional data thatis associated with a position in which an image used for operation isdisplayed, the arithmetic portion 111 executes a program associated inadvance with the image.

Memory Portion

The memory portion 112 stores the program to be executed by thearithmetic portion 111.

Note that an example of the program to be executed by the arithmeticdevice 110 is described in Embodiment 3.

Input and Output Interface and Transmission Path

The input and output interface 115 supplies data and is supplied withdata.

The transmission path 114 can supply data, and the arithmetic portion111, the memory portion 112, and the input and output interface 115 aresupplied with the data. In addition, the arithmetic portion 111, thememory portion 112, and the input and output interface 115 can supplydata, and the transmission path 114 is supplied with the data.

The data processing device 100 includes the arithmetic device 110, theinput and output device 120, and the housing 101 (see FIG. 2B).

Housing

The housing 101 protects the arithmetic device 110 and the like fromexternal stress.

The housing 101 can be formed using metal, plastic, glass, ceramics, orthe like.

Example 2 of Structure of Data Processing Device

Another structure of a data processing device of one embodiment of thepresent invention will be described with reference toFIGS. 3A1, 3A2,3A3, 3B, and 3C.

FIGS. 3A1, 3A2, 3A3, 3B, and 3C illustrate a structure of a dataprocessing device 100B of one embodiment of the present invention.

FIGS. 3A1 and 3A2 are front and rear perspective views, respectively, ofthe data processing device 100B of one embodiment of the presentinvention. FIG. 3A3 is a top view thereof.

FIG. 3B is a schematic diagram illustrating the appearance of thepositional data input portion 140 and the display portion 130 which canbe used in the data processing device 100B.

FIG. 3C illustrates a usage state of the data processing device 100B.

The data processing device 100B described in this embodiment differsfrom the data processing device 100 described with reference to FIGS.2A, 2B, 2C1, 2C2, and 2D, in including the second sensing portion 150(2)that senses an object obscuring the second display portion 130(2) andsupplies the second sensing data S2. Different parts are described indetail below, and the above description is referred to for the othersimilar parts.

In the data processing device 100B described in this embodiment, theinput and output device 120 includes the second sensing portion 150(2)that senses an object obscuring the second display portion 130(2) andsupplies the second sensing data S2.

The arithmetic device 110 is supplied with the second sensing data S2.

The arithmetic portion 111 generates the first image data V1 and/or thesecond image data V2 based on the first sensing data S1 and/or thesecond sensing data S2.

The data processing device 100B described in this embodiment cangenerate image data based on sensing data supplied from one region anddisplay it on the input and output device. Consequently, a novel dataprocessing device can be provided.

When the data processing device 100B is put in a breast pocket of user'sclothes with the second region 120(2) facing upward, the user can easilysee text or image information displayed on the second region 120(2)while the data processing device 100B is placed in the pocket (see FIG.3C).

For example, the user can see, from above, the second region 120(2)displaying the phone number, name, and the like of the caller of anincoming call.

Note that the data processing device 100B can be provided with avibration sensor or the like and a memory device that stores a programfor shifting a mode into an incoming call rejection mode in accordancewith vibration sensed by the vibration sensor or the like. Thus, theuser can shift the mode into the incoming call rejection mode by tappingthe data processing device 100B over his/her clothes so as to applyvibration.

Display Portion

There is no particular limitation on the display portion 130 as long asthe display portion 130 can display supplied image data (see FIG. 3B).For example, the display portion that can be used in the data processingdevice 100 can be used in the data processing device 100B.

The display portion 130 includes the first display portion 130(1) andthe second display portion 130(2). Note that a plurality of seconddisplay portions 130(2) may be provided.

The first display portion 130(1) displays the first image data V1 thatis supplied thereto, and the second display portion 130(2) displays thesecond image data V2 that is supplied thereto.

The first display portion 130(1) and the second display portion 130(2)may be driven as one display portion. For example, one driver circuitmay supply signals to select scan lines.

The first display portion 130(1) and the second display portion 130(2)may be driven as different display portions. For example, separatedriver circuits may be provided for the display portions, and the drivercircuits may supply signals to select scan lines to the correspondingdisplay portions.

For example, when the data processing device 100B is in a standby state,only the second display portion 130(2) may be driven, and drive of thefirst display portion 130(1) may be stopped. Stopping drive of the firstdisplay portion 130(1) can reduce power consumption.

Note that a flexible display portion which can be bent at positionsoverlapping with the first curved portion 120 c(1) and the second curvedportion 120 c(2) can be used as the display portion 130. Specificexamples of structures that can be employed in the display portion 130are described in Embodiments 4 to 6.

Sensing Portion

The sensing portion 150 senses the states of the data processing device100B and the circumstances and supplies sensing data (see FIGS. 1 andFIGS. 3A1 and 3A2 ).

The sensing portion 150 includes the first sensing portion 150(1) andthe second sensing portion 150(2). The first sensing portion senses anobject obscuring the first display portion 130(1), and the secondsensing portion senses an object obscuring the second display portion130(2). Then, the first sensing portion 150(1) supplies the firstsensing data S1 including data about whether the first display portion130(1) is obscured or not, and the second sensing portion 150(2)supplies the second sensing data S2 including data about whether thesecond display portion 130(2) is obscured or not. Note that in the casewhere a plurality of second display portions are provided, the secondsensing data includes data about whether any one of the second displayportions is obscured or not.

A sensing element that can be used in the first sensing portion 150(1)can be used in the second sensing portion 150(2). For example, aphotoelectric conversion element provided so as to sense an objectobscuring the second display portion 130(2) can be used in the secondsensing portion 150(2).

Specifically, a photoelectric conversion element 150PD(1) is provided inthe first region 120(1) so as to sense the intensity of light incidentfrom a side where the first region 120(1) displays an image, and aphotoelectric conversion element 150PD(2) is provided in the secondregion 120(2) so as to sense the intensity of light incident from a sidewhere the second display portion 130(2) displays an image (see FIGS. 3A1or 3A2 ).

This makes it possible to sense that the first region including thephotoelectric conversion element 150PD(1) and/or the second regionincluding the photoelectric conversion element 150PD(2) of the dataprocessing device 100B are/is covered with a protective case or coverfor the data processing device 100B, clothes, or the like.

The sensing portion 150 may be configured to sense an object obscuringanother display portion.

Positional Data Input Portion

There is no particular limitation on the positional data input portion140 as long as the positional data input portion 140 can supplypositional data (see FIG. 3B). For example, the positional data inputportion that can be used in the data processing device 100 can be usedin the data processing device 100B.

Note that a flexible positional data input portion which can be bent ata position overlapping with the first curved portion 120 c(1) can beused as the positional data input portion 140. Specific examples ofstructures that can be employed in the positional data input portion 140are described in Embodiments 4 to 6.

Note that this embodiment can be combined with any of the otherembodiments in this specification as appropriate.

Embodiment 2

In this embodiment, a structure of a data processing device of oneembodiment of the present invention will be described with reference toFIGS. 4 and FIGS. 5A1, 5A2, 5B, 5C, and 5D.

FIG. 4 illustrates that a display portion 130, a positional data inputportion 140, and a sensing portion 150 of a data processing device 100Cof one embodiment of the present invention differ from those of the dataprocessing device 100 illustrated in FIG. 1 .

FIGS. 5A1, 5A2, 5B, 5C, and 5D illustrate a structure of the dataprocessing device 100C of one embodiment of the present invention.

FIG. 5A1 is a top view of the data processing device 100C in an unfoldedstate, and FIG. 5A2 is a bottom view of the data processing device 100Cin the unfolded state.

FIG. 5B is a side view of the data processing device 100C, and FIG. 5Cis a side view including a cross section taken along a cutting-planeline Y1-Y2 in FIG. 5A1 .

FIGS. 6A1, 6A2, 6B1, and 6B2 illustrate the data processing device 100Cin half-folded states. FIGS. 6A1 and 6A2 are side views illustrating afolded state in which a display portion in a first region 120(1) facesinward. FIGS. 6B1 and 6B2 are side views illustrating a folded state inwhich the display portion in the first region 120(1) faces outward.

Example 3 of Structure of Data Processing Device

The data processing device 100C described in this embodiment (see FIG. 4) differs from the data processing device 100 described in Embodiment 1with reference to FIG. 1 , in the following points: the input and outputdevice 120 is supplied with first image data V1 (V1 includes V1 a and V1b) and the second image data V2 and supplies first positional data L1(L1 includes L1 a and L1 b), the second positional data L2, firstsensing data S1 (S1 includes S1 a and S1 b), and the second sensing dataS2; the first display portion 130(1) includes a display portion 130(1 a)and a display portion 130(1 b); the first positional data input portion140(1) includes a positional data input portion 140(1 a) and apositional data input portion 140(1 b); the first sensing portion 150(1)includes a sensing portion 150(1 a) and a sensing portion 150(1 b); andthe first region 120(1) includes the input and output device that can befolded or unfolded. Different parts are described in detail below, andthe above description is referred to for the other similar parts.

The input and output device 120 includes the first region 120(1) and thesecond region 120(2). The first region 120(1) includes the region 120(1a) and the region 120(1 b). The first region 120(1) can be folded at aportion between the region 120(1 a) and the region 120(1 b) (see FIG. 4).

The region 120(1 a) includes the display portion 130(1 a) and thepositional data input portion 140(1 a), and the region 120(1 b) includesthe display portion 130(1 b) and the positional data input portion 140(1b) (see FIG. 4 and FIG. 5C).

The second region 120(2) includes the display portion 130(2) and thepositional data input portion 140(2).

The sensing portion 150 includes the sensing portion 150(1 a), thesensing portion 150(1 b), and the sensing portion 150(2). The sensingportion 150(1 a) is provided in a housing 15 a so as to be able to sensean object obscuring the display portion in the region 120(1 a), and thesensing portion 150(1 b) is provided in a housing 15 b so as to be ableto sense an object obscuring the display portion in the region 120(1 b)(see FIG. 5A1 ).

FIGS. 6A1 and 6A2 are side views of the data processing device 100C in ahalf-folded state in which the sensing portion 150(1 a) is located onthe inner side. The region 120(1 a) faces the region 120(1 b), and theregion 120(1 a) is obscured by the region 120(1 b). The region 120(1 b)is obscured by the region 120(1 a).

The second region 120(2) of the data processing device 100C in thisfolded state can display an image in one direction indicated by an arrowin FIG. 6A1 .

The folded state in which the first region 120(1) faces inward can befound from the sensing data S1 a supplied from the sensing portion 150(1a) and/or the sensing data S1 b supplied from the sensing portion 150(1b). Then, drive of an obscured portion of the first display portion130(1) may be stopped. This can reduce power consumption.

FIGS. 6B1 and 6B2 illustrate the data processing device 100C in ahalf-folded state in which the sensing portion 150(1 a) is located onthe outer side. A back side of the region 120(1 a) faces a back side ofthe region 120(1 b), and the region 120(1 a) or the region 120(1 b) isnot obscured by the other region.

The first region 120(1) of the data processing device 100C in thisfolded state can display an image in three directions indicated byarrows in FIG. 6B2 . In addition, the second region 120(2) can displayan image in another direction.

The orientation of the data processing device 100C or the like can befound from the sensing data S1 a supplied from the sensing portion 150(1a), the sensing data S1 b supplied from the sensing portion 150(1 b), orsensing data supplied from a gravity sensor or a gyro sensor. Then, aportion where display is not necessary in the first region 120(1) may bedetermined from a combination of these pieces of sensing data, and itsdrive may be stopped. This can reduce power consumption.

The data processing device 100C includes the first region 120(1) whichcan be folded or unfolded. Accordingly, the data processing device 100Ccan be used with the first region having a highly portable size or ahighly browsable size. Consequently, a novel data processing device canbe provided.

The data processing device 100C includes the input and output device 120that is supplied with the first image data V1 and the second image dataV2 and supplies the first sensing data S1, and an arithmetic device 110that supplies the first image data V1 and the second image data V2 andis supplied with the first sensing data S1 (see FIG. 4 ).

The input and output device 120 includes a terminal 125 that is suppliedwith the first image data V1 and the second image data V2, the firstdisplay portion 130(1) that is supplied with and displays the firstimage data V1, the second display portion 130(2) that is supplied withand displays the second image data V2, and the first sensing portion150(1) that senses an object obscuring the first display portion 130(1)and supplies the first sensing data S1 (FIG. 4 and FIG. 5C).

The input and output device 120 also includes the first region 120(1)provided with the first display portion 130(1), the second region 120(2)provided with the second display portion 130(2), a third region 120(3)provided with the terminal 125, the first curved portion 120 c(1)between the first region 120(1) and the second region 120(2), and thesecond curved portion 120 c(2) between the first region 120(1) and thethird region 120(3) (FIG. 5C).

The third region 120(3) supplies the first image data V1 and the secondimage data V2. The first region 120(1) is supplied with the first imagedata V1 and the second image data V2 and supplies the second image dataV2. The second region 120(2) is supplied with the second image data V2(FIG. 5D).

The arithmetic portion 111 generates the first image data V1 or thesecond image data V2 based on the first sensing data S1.

The data processing device 100C includes the first region 120(1)provided with the first display portion 130(1), the second region 120(2)provided with the second display portion 130(2), the third region 120(3)provided with the terminal 125, the first curved portion 120 c(1)between the first region 120(1) and the second region 120(2), and thesecond curved portion 120 c(2) between the first region 120(1) and thethird region 120(3). Accordingly, the terminal 125 can supply the firstimage data V1 and the second image data V2. The first region 120(1) candisplay the first image data V1 and supplies the second image data V2,and the second region 120(2) can display the second image data V2.Consequently, a novel data processing device can be provided.

Individual components included in the data processing device 100C aredescribed below. Note that these portions cannot be clearlydistinguished and one portion also serves as another portion or includespart of another portion in some cases.

The data processing device 100C differs from the data processing devicedescribed in Embodiment 1 in that a foldable housing is included andthat the first region 120(1) can be folded. Different parts aredescribed in detail below, and the above description is referred to forthe other similar parts.

Entire Structure

The data processing device 100C includes the input and output device120, and the input and output device 120 includes the first region120(1) which can be folded or unfolded. In the input and output device120, the second region 120(2) is provided such that the first curvedportion 120 c(1) is located between the first region 120(1) and thesecond region 120(2), and the third region 120(3) is provided such thatthe second curved portion 120 c(2) is located between the first region120(1) and the third region 120(3) (see FIGS. 4 and FIGS. 5A1, 5A2, 5B,5C, and 5D). Note that a signal line is provided in the first region120(1), the second region 120(2), and the third region 120(3), and thefirst region 120(1) is electrically connected to the second region120(2) and the third region 120(3).

The first region 120(1) can be folded or unfolded and is held in afoldable housing.

Note that the sensing portion 150(1 a) and the sensing portion 150(1 b)may be provided.

Housing

The housing allows the first region 120(1) to be folded or unfolded.

For example, the data processing device 100C includes housings 13 a and13 b which are flexible and the housings 15 a and 15 b which are lessflexible than the housings 13 a and 13 b.

A flexible member or a hinge can be used for the foldable housing. Notethat the housing may be folded or unfolded by a method using user'shands, a spring, a motor, a piezoelectric element, or the like.

Specifically, a resin, a rubber, a silicone rubber, or the like can beused for the flexible member. Alternatively, a metal, an alloy, anengineering plastic, or the like can be used for the hinge.

The data processing device 100C may include a housing that is more rigidthan the foldable housing.

The housing 13 a is shaped so as not to obscure the first region 120(1)and the second region 120(2) (see FIG. 5A1 ), and the display portion130 and the positional data input portion 140 are provided between thehousing 13 a and the housing 13 b (see FIG. 5B).

The housings 13 a and 13 b connect the housings 15 a and 15 b (see FIGS.5A1 and 5A2 ).

The housing 15 a is shaped so as not to obscure the first region 120(1)(see FIGS. 5A1 and 5C).

In the housing 15 a, the arithmetic device 110 is stored. The arithmeticdevice 110 includes the terminal that supplies the first image data V1and the second image data V2 and is supplied with the first sensing dataS1.

The housing 15 b has an opening so as not to obscure the first region120(1) and the second region 120(2). Specifically, the housing 15 a hasan opening so as not to obscure the first region 120(1), and the housing15 b has an opening at a right-hand side surface so as not to obscurethe second region 120(2).

Note that a user of the data processing device 100C can hold the dataprocessing device 100C with the other hand such that the second region120(2) is positioned on a left-hand side.

The first image data V1 or the second image data V2 may be generated onthe basis of sensing data about the orientation of the data processingdevice 100C which is supplied from the sensing portion 150. Accordingly,favorable display can be performed according to which hand is used tohold the data processing device 100C. For example, a user can hold thehousing 15 a with his/her left hand so that his/her right hand can beused to supply positional data from the positional data input portion140(2) in the second region 120(2).

Display Portion and Positional Data Input Portion

The input and output device 120 includes the first region 120(1) thatcan be folded. Note that the first region 120(1) includes the firstdisplay portion 130(1) and the first sensing portion 150(1).

For example, an input and output device including a flexible substrateand a thin film element formed over the flexible substrate can be usedas the input and output device 120.

With the use of a foldable input and output device in the first region120(1) and the second region 120(2), the first region 120(1) and thesecond region 120(2) can be integrated. Note that specific examples ofstructures that can be employed in the foldable input and output device120 are described in Embodiments 4 to 6.

The input and output device 120 includes the terminal 125 in the thirdregion 120(3). The third region 120(3) includes the terminal 125 that issupplied with the first image data V1 and the second image data V2 andsupplies the first sensing data S1 (see FIG. 5D).

The input and output device 120 includes a plurality of wirings. Forexample, a wiring 126 is electrically connected to the terminal 125,through which a signal, a power supply potential, or the like can besupplied to the terminal.

Specifically, through a wiring in the third region 120(3), the firstimage data V1 and the second image data V2 supplied thereto are suppliedto the first region 120(1). Through a wiring in the first region 120(1),the second image data V2 supplied thereto is supplied to the secondregion 120(2).

Note that this embodiment can be combined with any of the otherembodiments in this specification as appropriate.

Embodiment 3

In this embodiment, a structure of a data processing device of oneembodiment of the present invention will be described with reference toFIGS. 7 and 8 .

FIG. 7 is a flowchart showing a program for the data processing deviceof one embodiment of the present invention. FIG. 8 is a flowchartillustrating an interrupt processing of the program described withreference to FIG. 7 .

Example 1 of Structure of Data Processing Device

The data processing devices 100, 100B, and 100C described in thisembodiment each include the memory portion 112 that stores the programincluding the following steps.

First Step

In a first step, initial data including status data is acquired (S1 inFIG. 7 ).

The initial data used in a later step is acquired. For example, as thestatus data, predetermined data may be used, or sensing data suppliedfrom the sensing portion may be used.

Second Step

In a second step, an interrupt processing is allowed (S2 in FIG. 7 ).Note that when the interrupt processing is allowed, the arithmeticportion 111 can receive an instruction to execute the interruptprocessing. The arithmetic portion 111 that has received the instructionto execute the interrupt processing stops the main processing andexecutes the interrupt processing. For example, the arithmetic portion111 that has received an event associated with the instruction executesthe interrupt processing, and stores the execution result in the memoryportion. Then, the arithmetic portion 111 that has returned from theinterrupt processing can resume the main processing on the basis of theexecution result of the interrupt processing.

Third Step

In a third step, predetermined data is acquired (S3 in FIG. 7 ).

Predetermined data which is the basis of first image data or secondimage data generated in a later step is acquired. For example, imagedata or text data whose size has not yet been optimized for the firstregion 120(1) or the second region 120(2) is acquired. Note that anoperating instruction or data supplied in the interrupt processing isreflected in the third and subsequent steps.

Fourth Step

In a fourth step, a fifth step is selected when the status data shows afirst status, or a sixth step is selected when the status data shows asecond status (S4 in FIG. 7 ).

For example, the fifth step is selected when the first region 120(1) isnot obscured according to the status data determined on the basis of thefirst sensing data S1 supplied from the first sensing portion 150(1), orthe sixth step is selected when the first region 120(1) is obscured.

Fifth Step

In the fifth step, the first image data V1 is generated on the basis ofthe data acquired in the third step, and the first image data V1 isdisplayed on the first display portion 130(1) (S5 in FIG. 7 ).

For example, the first image data V1 is generated such that textinformation is displayed in a single line or a plurality of lines. Itcan also be generated on the basis of the orientation or size of thefirst display portion 130(1) or a preferred design set by a user.

Sixth Step

In the sixth step, the second image data V2 is generated on the basis ofthe data acquired in the third step, and the second image data V2 isdisplayed on the second display portion 130(2) (S6 in FIG. 7 ).

For example, the second image data V2 is generated such that textinformation is displayed so as to move from one side to the other. Itcan also be generated on the basis of the orientation or size of thesecond display portion 130(2) or a preferred design set by a user.

Seventh Step

In a seventh step, an eighth step is selected when a terminationinstruction is supplied in the interrupt processing, or the third stepis selected when no termination instruction is supplied in the interruptprocessing (S7 in FIG. 7 ).

Eighth Step

In the eighth step, the program terminates (S8 in FIG. 7 ).

Interrupt Processing

The interrupt processing includes the following steps.

Ninth Step

In a ninth step, the first sensing data S1 and the second sensing dataS2 are acquired (T9 in FIG. 8 )

Specifically, the first sensing data S1 supplied from the first sensingportion 150(1) and the second sensing data S2 supplied from the secondsensing portion 150(2) are acquired using a timer or the like.

Tenth Step

In a tenth step, candidate data based on the first sensing data S1 isdetermined (T10 in FIG. 8 ).

Eleventh Step

In an eleventh step, a twelfth step is selected when the candidate datadiffers from the status data, or the ninth step is selected when thecandidate data is the same as the status data (T11 in FIG. 8 ).

Twelfth Step

In the twelfth step, the status data is updated with the candidate data(T12 in FIG. 8 ).

For example, the status data is updated when there is a change in thefirst sensing data S1.

Thirteenth Step

In a thirteenth step, the operation returns from the interruptprocessing (T13 in FIG. 8 ).

Note that the status data updated in the interrupt processing isreflected in the third and subsequent steps. The operation proceeds tothe eighth step and terminates when a termination instruction issupplied in the interrupt processing.

In the above-described data processing device of one embodiment of thepresent invention, the program includes the step of determining thecandidate data by acquiring the first sensing data; the step of updatingthe status data with the candidate data when the status data differsfrom the candidate data; and the step of generating and displaying imagedata including predetermined data based on the updated status data.Thus, an image including the predetermined data which is based on thestatus data can be displayed on a predetermined region. Consequently, anovel data processing device can be provided.

Note that this embodiment can be combined with any of the otherembodiments in this specification as appropriate.

Embodiment 4

In this embodiment, a structure of a bendable or foldable touch panelthat can be used in the display portion 130 and the positional datainput portion 140 of the data processing device of one embodiment of thepresent invention will be described with reference to FIGS. 9A to 9C.

FIG. 9A is a top view illustrating the structure of the touch panel thatcan be used in the data processing device of one embodiment of thepresent invention.

FIG. 9B is a cross-sectional view taken along cutting-plane lines A-Band C-D in FIG. 9A.

FIG. 9C is a cross-sectional view taken along a cutting-plane line E-Fin FIG. 9A.

Top View

A touch panel 300 described as an example in this embodiment includes adisplay portion 301 (see FIG. 9A).

The display portion 301 includes a plurality of pixels 302 and aplurality of imaging pixels 308. The imaging pixels 308 can sense atouch of a finger or the like on the display portion 301. Thus, a touchsensor can be formed using the imaging pixels 308.

Each of the pixels 302 includes a plurality of sub-pixels (e.g., asub-pixel 302R). In the sub-pixels, light-emitting elements and pixelcircuits that can supply electric power for driving the light-emittingelements are provided.

The pixel circuits are electrically connected to wirings through whichselection signals and image signals are supplied.

The touch panel 300 is provided with a scan line driver circuit 303 g(1)that can supply selection signals to the pixels 302 and an image signalline driver circuit 303 s(1) that can supply image signals to the pixels302.

The imaging pixels 308 include photoelectric conversion elements andimaging pixel circuits that drive the photoelectric conversion elements.

The imaging pixel circuits are electrically connected to wirings throughwhich control signals and power supply potentials are supplied.

Examples of the control signals include a signal for selecting animaging pixel circuit from which a recorded imaging signal is read, asignal for initializing an imaging pixel circuit, and a signal fordetermining the time for an imaging pixel circuit to sense light.

The touch panel 300 is provided with an imaging pixel driver circuit 303g(2) that can supply control signals to the imaging pixels 308 and animaging signal line driver circuit 303 s(2) that reads out imagingsignals.

Cross-Sectional View

The touch panel 300 includes a substrate 310 and a counter substrate 370opposite to the substrate 310 (see FIG. 9B).

By using a flexible material for the substrate 310 and the countersubstrate 370, the touch panel 300 can have flexibility.

Note that when the flexible touch panel 300 is changed in shape, stressis applied to a functional element provided in the touch panel 300. Afunctional element is preferably positioned in the center between thesubstrate 310 and the counter substrate 370 because a change in shape ofthe functional element can be prevented.

Furthermore, the substrate 310 is preferably formed using a materialwhose coefficient of linear expansion is substantially equal to that ofthe counter substrate 370. For example, the coefficients of linearexpansion of the materials are preferably lower than or equal to 1 ×10⁻³/K, further preferably lower than or equal to 5 × 10⁻⁵/K, and stillfurther preferably lower than or equal to 1 × 10⁻⁵/K.

For example, materials that include polyester, polyolefin, polyamide(e.g., nylon, aramid), polyimide, polycarbonate, or a resin having anacrylic bond, a urethane bond, an epoxy bond, or a siloxane bond can beused for the substrate 310 and the counter substrate 370.

The substrate 310 is a stacked body in which a substrate 310 b havingflexibility, a barrier film 310 a that prevents unintentional diffusionof impurities to the light-emitting elements, and a resin layer 310 cthat attaches the barrier film 310 a to the substrate 310 b are stacked.

The counter substrate 370 is a stacked body including a substrate 370 bhaving flexibility, a barrier film 370 a that prevents unintentionaldiffusion of impurities to the light-emitting elements, and a resinlayer 370 c that attaches the barrier film 370 a to the substrate 370 b(see FIG. 9B).

A sealant 360 attaches the counter substrate 370 to the substrate 310.The sealant 360, also serving as an optical adhesive layer, has arefractive index higher than that of air. The pixel circuits and thelight-emitting elements (e.g., a first light-emitting element 350R) areprovided between the substrate 310 and the counter substrate 370.

Structure of Pixel

Each of the pixels 302 includes the sub-pixel 302R, a sub-pixel 302G,and a sub-pixel 302B (see FIG. 9C). The sub-pixel 302R includes alight-emitting module 380R, the sub-pixel 302G includes a light-emittingmodule 380G, and the sub-pixel 302B includes a light-emitting module380B.

For example, the sub-pixel 302R includes the first light-emittingelement 350R and the pixel circuit that can supply electric power to thefirst light-emitting element 350R and includes a transistor 302 t (seeFIG. 9B). The light-emitting module 380R includes the firstlight-emitting element 350R and an optical element (e.g., a firstcoloring layer 367R).

The first light-emitting element 350R includes a first lower electrode351R, an upper electrode 352, and a layer 353 containing alight-emitting organic compound between the first lower electrode 351Rand the upper electrode 352 (see FIG. 9C).

The layer 353 containing a light-emitting organic compound includes alight-emitting unit 353 a, a light-emitting unit 353 b, and anintermediate layer 354 between the light-emitting units 353 a and 353 b.

The first coloring layer 367R of the light-emitting module 380R isprovided on the counter substrate 370. The coloring layer transmitslight of a particular wavelength and is, for example, a layer thatselectively transmits light of red, green, or blue color. A region thattransmits light emitted from the light-emitting element as it is may beprovided.

The light-emitting module 380R, for example, includes the sealant 360that is in contact with the first light-emitting element 350R and thefirst coloring layer 367R.

The first coloring layer 367R is positioned in a region overlapping withthe first light-emitting element 350R. Accordingly, part of lightemitted from the first light-emitting element 350R passes through thesealant 360 that also serves as an optical adhesive layer and throughthe first coloring layer 367R and is emitted to the outside of thelight-emitting module 380R as indicated by arrows in FIGS. 9B and 9C.

Structure of Display Panel

The touch panel 300 includes a light-blocking layer 367BM on the countersubstrate 370. The light-blocking layer 367BM is provided so as tosurround the coloring layer (e.g., the first coloring layer 367R).

The touch panel 300 includes an anti-reflective layer 367 p positionedin a region overlapping with the display portion 301. As theanti-reflective layer 367 p, a circular polarizing plate can be used,for example.

The touch panel 300 includes an insulating film 321. The insulating film321 covers the transistor 302 t. Note that the insulating film 321 canbe used as a layer for planarizing unevenness caused by the pixelcircuits. An insulating film on which a layer that can prevent diffusionof impurities to the transistor 302 t and the like is stacked can beused as the insulating film 321.

The touch panel 300 includes the light-emitting elements (e.g., thefirst light-emitting element 350R) over the insulating film 321.

The touch panel 300 includes, over the insulating film 321, a partitionwall 328 that overlaps with an end portion of the first lower electrode351R (see FIG. 9C). In addition, a spacer 329 that controls the distancebetween the substrate 310 and the counter substrate 370 is provided overthe partition wall 328.

Structure of Image Signal Line Driver Circuit

The image signal line driver circuit 303 s(1) includes a transistor 303t and a capacitor 303 c. Note that the driver circuit can be formed inthe same process and over the same substrate as those of the pixelcircuits.

Structure of Imaging Pixel

The imaging pixels 308 each include a photoelectric conversion element308 p and an imaging pixel circuit for sensing light received by thephotoelectric conversion element 308 p. The imaging pixel circuitincludes a transistor 308 t.

For example, a PIN photodiode can be used as the photoelectricconversion element 308 p.

Other Components

The touch panel 300 includes a wiring 311 through which a signal issupplied. The wiring 311 is provided with a terminal 319. Note that anFPC 309(1) through which a signal such as an image signal or asynchronization signal is supplied is electrically connected to theterminal 319.

Note that a printed wiring board (PWB) may be attached to the FPC309(1).

Transistors formed in the same process can be used as the transistor 302t, the transistor 303 t, the transistor 308 t, and the like.

Transistors of a bottom-gate type, a top-gate type, or the like can beused.

Any of various kinds of semiconductors can be used in the transistors.For example, an oxide semiconductor, single crystal silicon,polysilicon, amorphous silicon, or the like can be used.

Note that this embodiment can be combined with any of the otherembodiments in this specification as appropriate.

Embodiment 5

In this embodiment, a structure of a bendable or foldable touch panelthat can be used in the data processing device of one embodiment of thepresent invention will be described with reference to FIGS. 10A and 10Band FIGS. 11A to 11C.

FIG. 10A is a perspective view of a touch panel 500 described as anexample in this embodiment. Note that FIGS. 10A and 10B illustrate onlymain components for simplicity. FIG. 10B is a developed perspective viewof the touch panel 500.

FIGS. 11A to 11C are cross-sectional views of the touch panel 500 takenalong line X1-X2 in FIG. 10A.

The touch panel 500 includes a display portion 501 and a touch sensor595 (see FIG. 10B). The touch panel 500 includes a substrate 510, asubstrate 570, and a substrate 590. Note that the substrate 510, thesubstrate 570, and the substrate 590 each have flexibility.

The display portion 501 includes the substrate 510, a plurality ofpixels over the substrate 510, a plurality of wirings 511 through whichsignals are supplied to the pixels, and an image signal line drivercircuit 503 s(1). The plurality of wirings 511 are led to a peripheralportion of the substrate 510, and parts of the plurality of wirings 511form a terminal 519. The terminal 519 is electrically connected to anFPC 509(1).

Touch Sensor

The substrate 590 includes the touch sensor 595 and a plurality ofwirings 598 electrically connected to the touch sensor 595. Theplurality of wirings 598 are led to a peripheral portion of thesubstrate 590, and parts of the plurality of wirings 598 form aterminal. The terminal is electrically connected to an FPC 509(2). Notethat in FIG. 10B, electrodes, wirings, and the like of the touch sensor595 provided on the back side of the substrate 590 (the side facing thesubstrate 510) are indicated by solid lines for clarity.

As the touch sensor 595, a capacitive touch sensor can be used. Examplesof the capacitive touch sensor are a surface capacitive touch sensor anda projected capacitive touch sensor.

Examples of the projected capacitive touch sensor are a self capacitivetouch sensor and a mutual capacitive touch sensor, which differ mainlyin the driving method. The use of a mutual capacitive type is preferablebecause multiple points can be sensed simultaneously.

An example of using a projected capacitive touch sensor is describedbelow with reference to FIG. 10B.

Note that a variety of sensors that can sense proximity or touch of asensing target such as a finger can be used.

The projected capacitive touch sensor 595 includes electrodes 591 andelectrodes 592. The electrodes 591 are electrically connected to any ofthe plurality of wirings 598, and the electrodes 592 are electricallyconnected to any of the other wirings 598.

The electrodes 592 each have a shape of a plurality of quadranglesarranged in one direction with one corner of a quadrangle connected toone corner of another quadrangle as illustrated in FIGS. 10A and 10B.

The electrodes 591 each have a quadrangular shape and are arranged in adirection intersecting with the direction in which the electrodes 592extend.

A wiring 594 electrically connects two electrodes 591 between which theelectrode 592 is positioned. The intersecting area of the electrode 592and the wiring 594 is preferably as small as possible. Such a structureallows a reduction in the area of a region where the electrodes are notprovided, reducing unevenness in transmittance. As a result, unevennessin luminance of light passing through the touch sensor 595 can bereduced.

Note that the shapes of the electrodes 591 and the electrodes 592 arenot limited thereto and can be any of a variety of shapes. For example,a structure may be employed in which the plurality of electrodes 591 arearranged so that gaps between the electrodes 591 are reduced as much aspossible, and the electrodes 592 are spaced apart from the electrodes591 with an insulating layer interposed therebetween to have regions notoverlapping with the electrodes 591. In this case, it is preferable toprovide, between two adjacent electrodes 592, a dummy electrodeelectrically insulated from these electrodes because the area of regionshaving different transmittances can be reduced.

The structure of the touch sensor 595 is described with reference toFIGS. 11A to 11C.

The touch sensor 595 includes the substrate 590, the electrodes 591 andthe electrodes 592 provided in a staggered arrangement on the substrate590, an insulating layer 593 covering the electrodes 591 and theelectrodes 592, and the wiring 594 that electrically connects theadjacent electrodes 591 to each other.

A resin layer 597 attaches the substrate 590 to the substrate 570 sothat the touch sensor 595 overlaps with the display portion 501.

The electrodes 591 and the electrodes 592 are formed using alight-transmitting conductive material. As a light-transmittingconductive material, a conductive oxide such as indium oxide, indium tinoxide, indium zinc oxide, zinc oxide, or zinc oxide to which gallium isadded can be used. Note that a film including graphene may be used aswell. The film including graphene can be formed, for example, byreducing a film containing graphene oxide. As a reducing method, amethod with application of heat or the like can be employed.

The electrodes 591 and the electrodes 592 may be formed by depositing alight-transmitting conductive material on the substrate 590 by asputtering method and then removing an unnecessary portion by any ofvarious patterning techniques such as photolithography.

Examples of a material for the insulating layer 593 are a resin such asan acrylic resin or an epoxy resin, a resin having a siloxane bond, andan inorganic insulating material such as silicon oxide, siliconoxynitride, or aluminum oxide.

Openings reaching the electrodes 591 are formed in the insulating layer593, and the wiring 594 electrically connects the adjacent electrodes591. A light-transmitting conductive material can be favorably used asthe wiring 594 because the aperture ratio of the touch panel can beincreased. Moreover, a material with higher conductivity than theconductivities of the electrodes 591 and 592 can be favorably used forthe wiring 594 because electric resistance can be reduced.

One electrode 592 extends in one direction, and a plurality ofelectrodes 592 are provided in the form of stripes.

The wiring 594 intersects with the electrode 592.

Adjacent electrodes 591 are provided with one electrode 592 providedtherebetween. The wiring 594 electrically connects the adjacentelectrodes 591.

Note that the plurality of electrodes 591 are not necessarily arrangedin the direction orthogonal to one electrode 592 and may be arranged tointersect with one electrode 592 at an angle of less than 90 degrees.

One wiring 598 is electrically connected to any of the electrodes 591and 592. Part of the wiring 598 functions as a terminal. For the wiring598, a metal material such as aluminum, gold, platinum, silver, nickel,titanium, tungsten, chromium, molybdenum, iron, cobalt, copper, orpalladium or an alloy material containing any of these metal materialscan be used.

Note that an insulating layer that covers the insulating layer 593 andthe wiring 594 may be provided to protect the touch sensor 595.

A connection layer 599 electrically connects the wiring 598 to the FPC509(2).

As the connection layer 599, any of various anisotropic conductive films(ACF), anisotropic conductive pastes (ACP), or the like can be used.

The resin layer 597 has a light-transmitting property. For example, athermosetting resin or an ultraviolet curable resin can be used;specifically, a resin such as an acrylic resin, a urethane resin, anepoxy resin, or a resin having a siloxane bond can be used.

Display Portion

The display portion 501 includes a plurality of pixels arranged in amatrix. Each of the pixels includes a display element and a pixelcircuit for driving the display element.

In this embodiment, an example of using an organic electroluminescentelement that emits white light as a display element will be described;however, the display element is not limited to such an element.

For example, organic electroluminescent elements that emit light ofdifferent colors may be included in sub-pixels so that the light ofdifferent colors can be emitted from the respective sub-pixels.

Other than organic electroluminescent elements, any of various displayelements such as display elements (electronic ink) that perform displayby an electrophoretic method, an electronic liquid powder method, anelectrowetting method, or the like; MEMS shutter display elements;optical interference type MEMS display elements; and liquid crystalelements can be used. Furthermore, this embodiment can be used in atransmissive liquid crystal display, a transflective liquid crystaldisplay, a reflective liquid crystal display, a direct-view liquidcrystal display, or the like. In the case of a transflective liquidcrystal display or a reflective liquid crystal display, some of or allof pixel electrodes function as reflective electrodes. For example, someor all of pixel electrodes are formed to contain aluminum, silver, orthe like. In such a case, a memory circuit such as an SRAM can beprovided under the reflective electrodes, leading to lower powerconsumption. A structure suitable for employed display elements can beselected from a variety of structures of pixel circuits.

In the display portion, an active matrix method in which an activeelement is included in a pixel or a passive matrix method in which anactive element is not included in a pixel can be used.

In an active matrix method, as an active element (a non-linear element),not only a transistor but also various active elements (non-linearelements) can be used. For example, a metal insulator metal (MIM), athin film diode (TFD), or the like can also be used. Since such anelement has few numbers of manufacturing steps, manufacturing cost canbe reduced or yield can be improved. Alternatively, since the size ofthe element is small, the aperture ratio can be improved, so that powerconsumption can be reduced or higher luminance can be achieved.

As a method other than the active matrix method, the passive matrixmethod in which an active element (a non-linear element) is not used canalso be used. Since an active element (a non-linear element) is notused, the number of manufacturing steps is small, so that manufacturingcost can be reduced or yield can be improved. Alternatively, since anactive element (a non-linear element) is not used, the aperture ratiocan be improved, so that power consumption can be reduced or higherluminance can be achieved, for example.

Flexible materials can be favorably used for the substrate 510 and thesubstrate 570.

Materials with which unintended passage of impurities is inhibited canbe favorably used for the substrate 510 and the substrate 570. Forexample, materials with a vapor permeability of lower than or equal to10⁻⁵ g/m²·day, preferably lower than or equal to 10⁻⁶ g/m²·day can befavorably used.

The substrate 510 can be favorably formed using a material whosecoefficient of linear expansion is substantially equal to that of thesubstrate 570. For example, the coefficients of linear expansion of thematerials are preferably lower than or equal to 1 × 10⁻³/K, furtherpreferably lower than or equal to 5 × 10⁻⁵/K, and still furtherpreferably lower than or equal to 1 × 10⁻⁵/K.

The substrate 510 is a stacked body in which a substrate 510 b havingflexibility, a barrier film 510 a that prevents unintentional diffusionof impurities to the light-emitting elements, and a resin layer 510 cthat attaches the barrier film 510 a to the substrate 510 b are stacked.

For example, materials that include polyester, polyolefin, polyamide(e.g., nylon, aramid), polyimide, polycarbonate, or a resin having anacrylic bond, a urethane bond, an epoxy bond, or a siloxane bond can beused for the resin layer 510 c.

The substrate 570 is a stacked body including a substrate 570 b havingflexibility, a barrier film 570 a that prevents unintentional diffusionof impurities to the light-emitting elements, and a resin layer 570 cthat attaches the barrier film 570 a to the substrate 570 b.

A sealant 560 attaches the substrate 570 to the substrate 510. Thesealant 560 has a refractive index higher than that of air. In the casewhere light is extracted to the sealant 560 side, the sealant 560 servesas an optical adhesive layer. The pixel circuits and the light-emittingelements (e.g., a first light-emitting element 550R) are providedbetween the substrate 510 and the substrate 570.

Structure of Pixel

A pixel includes a sub-pixel 502R, and the sub-pixel 502R includes alight-emitting module 580R.

The sub-pixel 502R includes the first light-emitting element 550R andthe pixel circuit that can supply electric power to the firstlight-emitting element 550R and includes a transistor 502 t. Thelight-emitting module 580R includes the first light-emitting element550R and an optical element (e.g., a first coloring layer 567R).

The first light-emitting element 550R includes a lower electrode, anupper electrode, and a layer containing a light-emitting organiccompound between the lower electrode and the upper electrode.

The light-emitting module 580R includes the first coloring layer 567R onthe light extraction side. The coloring layer transmits light of aparticular wavelength and is, for example, a layer that selectivelytransmits light of red, green, or blue color. Note that in anothersub-pixel, a region that transmits light emitted from the light-emittingelement as it is may be provided as well.

In the case where the sealant 560 is provided on the light extractionside, the sealant 560 is in contact with the first light-emittingelement 550R and the first coloring layer 567R.

The first coloring layer 567R is positioned in a region overlapping withthe first light-emitting element 550R. Accordingly, part of lightemitted from the first light-emitting element 550R passes through thefirst coloring layer 567R and is emitted to the outside of thelight-emitting module 580R as indicated by an arrow in FIG. 11A.

Structure of Display Portion

The display portion 501 includes a light-blocking layer 567BM on thelight extraction side. The light-blocking layer 567BM is provided so asto surround the coloring layer (e.g., the first coloring layer 567R).

The display portion 501 is provided with an anti-reflective layer 567 ppositioned in a region overlapping with pixels. As the anti-reflectivelayer 567 p, a circular polarizing plate can be used, for example.

The display portion 501 includes an insulating film 521. The insulatingfilm 521 covers the transistor 502 t. Note that the insulating film 521can be used as a layer for planarizing unevenness caused by the pixelcircuits. A stacked film including a layer that can prevent diffusion ofimpurities can be used as the insulating film 521. This can prevent thereliability of the transistor 502 t or the like from being lowered byunintentional diffusion of impurities.

The display portion 501 includes the light-emitting elements (e.g., thefirst light-emitting element 550R) over the insulating film 521.

The display portion 501 includes, over the insulating film 521, apartition wall 528 that overlaps with an end portion of the lowerelectrode. In addition, a spacer that controls the distance between thesubstrate 510 and the substrate 570 is provided over the partition wall528.

Structure of Scan Line Driver Circuit

A scan line driver circuit 503 g(1) includes a transistor 503 t and acapacitor 503 c. Note that the driver circuit can be formed in the sameprocess and over the same substrate as those of the pixel circuits.

Other Components

The display portion 501 includes the wiring 511 through which a signalis supplied. The wiring 511 is provided with the terminal 519. Note thatthe FPC 509(1) through which a signal such as an image signal or asynchronization signal is supplied is electrically connected to theterminal 519.

Note that a printed wiring board (PWB) may be attached to the FPC509(1).

The display portion 501 includes wirings such as scan lines, signallines, and power supply lines. Any of various conductive films can beused as the wirings.

Specifically, a metal element selected from aluminum, chromium, copper,tantalum, titanium, molybdenum, tungsten, nickel, yttrium, zirconium,silver, and manganese; an alloy including any of the above-describedmetal elements; an alloy including any of the above-described metalelements in combination; or the like can be used. In particular, one ormore elements selected from aluminum, chromium, copper, tantalum,titanium, molybdenum, and tungsten are preferably included. Inparticular, an alloy of copper and manganese is suitably used inmicrofabrication with the use of a wet etching method.

Specifically, a two-layer structure in which a titanium film is stackedover an aluminum film, a two-layer structure in which a titanium film isstacked over a titanium nitride film, a two-layer structure in which atungsten film is stacked over a titanium nitride film, a two-layerstructure in which a tungsten film is stacked over a tantalum nitridefilm or a tungsten nitride film, a three-layer structure in which atitanium film, an aluminum film, and a titanium film are stacked in thisorder, or the like can be used.

Specifically, a stacked structure in which an alloy film or a nitridefilm containing one or more elements selected from titanium, tantalum,tungsten, molybdenum, chromium, neodymium, and scandium is stacked overan aluminum film can be used.

Alternatively, a light-transmitting conductive material including indiumoxide, tin oxide, or zinc oxide may be used.

Modification Example 1 of Display Portion

Any of various kinds of transistors can be used in the display portion501.

A structure in which bottom-gate transistors are used in the displayportion 501 is illustrated in FIGS. 11A and 11B.

For example, a semiconductor layer containing an oxide semiconductor,amorphous silicon, or the like can be used in the transistor 502 t andthe transistor 503 t shown in FIG. 11A.

For example, a film represented by an In-M-Zn oxide that contains atleast indium (In), zinc (Zn), and M (M is a metal such as Al, Ga, Ge, Y,Zr, Sn, La, Ce, or Hf) is preferably included. Alternatively, both Inand Zn are preferably contained.

As a stabilizer, gallium (Ga), tin (Sn), hafnium (Hf), aluminum (Al),zirconium (Zr), or the like can be given. As another stabilizer,lanthanoid such as lanthanum (La), cerium (Ce), praseodymium (Pr),neodymium (Nd), samarium (Sm), europium (Eu), gadolinium (Gd), terbium(Tb), dysprosium (Dy), holmium (Ho), erbium (Er), thulium (Tm),ytterbium (Yb), or lutetium (Lu) can be given.

As an oxide semiconductor included in an oxide semiconductor film, anyof the following can be used, for example: an In-Ga-Zn-based oxide, anIn-Al-Zn-based oxide, an In-Sn-Zn-based oxide, an In-Hf-Zn-based oxide,an In-La-Zn-based oxide, an In-Ce-Zn-based oxide, an In-Pr-Zn-basedoxide, an In-Nd-Zn-based oxide, an In-Sm-Zn-based oxide, anIn-Eu-Zn-based oxide, an In-Gd-Zn-based oxide, an In-Tb-Zn-based oxide,an In-Dy-Zn-based oxide, an In-Ho-Zn-based oxide, an In-Er-Zn-basedoxide, an In-Tm-Zn-based oxide, an In-Yb-Zn-based oxide, anIn-Lu-Zn-based oxide, an In-Sn-Ga-Zn-based oxide, an In-Hf-Ga-Zn-basedoxide, an In-Al-Ga-Zn-based oxide, an In-Sn-Al-Zn-based oxide, anIn-Sn-Hf-Zn-based oxide, an In-Hf-Al-Zn-based oxide, and an In-Ga-basedoxide.

Note that here, an "In-Ga-Zn-based oxide" means an oxide containing In,Ga, and Zn as its main components and there is no limitation on theratio of In:Ga:Zn. The In-Ga-Zn-based oxide may contain another metalelement in addition to In, Ga, and Zn.

For example, a semiconductor layer containing polycrystalline siliconthat is obtained by crystallization process such as laser annealing canbe used in the transistor 502 t and the transistor 503 t shown in FIG.11B.

A structure in which top-gate transistors are used in the displayportion 501 is shown in FIG. 11C.

For example, a semiconductor layer including polycrystalline silicon, asingle crystal silicon film that is transferred from a single crystalsilicon substrate, or the like can be used in the transistor 502 t andthe transistor 503 t shown in FIG. 11C.

Note that this embodiment can be combined with any of the otherembodiments in this specification as appropriate.

Embodiment 6

In this embodiment, a structure of a bendable or foldable touch panelthat can be used in a data processing device of one embodiment of thepresent invention will be described with reference to FIGS. 12A to 12C.

FIGS. 12A to 12C are cross-sectional views illustrating a touch panel500B.

The touch panel 500B described in this embodiment is different from thetouch panel 500 described in Embodiment 5 in that the display portion501 displays supplied image data on the side where the transistors areprovided and that the touch sensor is provided on the substrate 510 sideof the display portion. Different parts are described in detail below,and the above description is referred to for the other similar parts.

Display Portion

The display portion 501 includes a plurality of pixels arranged in amatrix. Each of the pixels includes a display element and a pixelcircuit for driving the display element.

Structure of Pixel

A pixel includes a sub-pixel 502R, and the sub-pixel 502R includes alight-emitting module 580R.

The sub-pixel 502R includes a first light-emitting element 550R and apixel circuit that can supply electric power to the first light-emittingelement 550R and includes a transistor 502 t.

The light-emitting module 580R includes the first light-emitting element550R and an optical element (e.g., a first coloring layer 567R).

The first light-emitting element 550R includes a lower electrode, anupper electrode, and a layer containing a light-emitting organiccompound between the lower electrode and the upper electrode.

The light-emitting module 580R includes the first coloring layer 567R onthe light extraction side. The coloring layer transmits light of aparticular wavelength and is, for example, a layer that selectivelytransmits light of red, green, or blue color. Note that in anothersub-pixel, a region that transmits light emitted from the light-emittingelement as it is may be provided as well.

The first coloring layer 567R is positioned in a region overlapping withthe first light-emitting element 550R. The first light-emitting element550R shown in FIG. 12A emits light to the side where the transistor 502t is provided. Accordingly, part of light emitted from the firstlight-emitting element 550R passes through the first coloring layer 567Rand is emitted to the outside of the light-emitting module 580R asindicated by an arrow in FIG. 12A.

Structure of Display Portion

The display portion 501 includes a light-blocking layer 567BM on thelight extraction side. The light-blocking layer 567BM is provided so asto surround the coloring layer (e.g., the first coloring layer 567R).

The display portion 501 includes an insulating film 521. The insulatingfilm 521 covers the transistor 502 t. Note that the insulating film 521can be used as a layer for planarizing unevenness caused by the pixelcircuits. A stacked film including a layer that can prevent diffusion ofimpurities can be used as the insulating film 521. This can prevent thereliability of the transistor 502 t or the like from being lowered byunintentional diffusion of impurities from the first coloring layer567R, for example.

Touch Sensor

A touch sensor 595 is provided on the substrate 510 side of the displayportion 501 (see FIG. 12A).

A resin layer 597 is provided between the substrate 510 and thesubstrate 590 and attaches the touch sensor 595 to the display portion501.

Modification Example 1 of Display Portion

Any of various kinds of transistors can be used in the display portion501.

A structure in which bottom-gate transistors are used in the displayportion 501 is illustrated in FIGS. 12A and 12B.

For example, a semiconductor layer containing an oxide semiconductor,amorphous silicon, or the like can be used in the transistor 502 t andthe transistor 503 t shown in FIG. 12A. In the transistors, a channelformation region may be sandwiched between upper and lower gateelectrodes, in which case variations in characteristics of thetransistors can be prevented and thus the reliability can be increased.

For example, a semiconductor layer containing polycrystalline silicon orthe like can be used in the transistor 502 t and the transistor 503 tshown in FIG. 12B.

A structure in which top-gate transistors are used in the displayportion 501 is shown in FIG. 12C.

For example, a semiconductor layer including polycrystalline silicon, atransferred single crystal silicon film, or the like can be used in thetransistor 502 t and the transistor 503 t shown in FIG. 12C.

Note that this embodiment can be combined with any of the otherembodiments in this specification as appropriate.

Embodiment 7

In this embodiment, a method for manufacturing a bendable or foldabledevice that can be used in a data processing device of one embodiment ofthe present invention, an electronic device, or the like will bedescribed with reference to FIGS. 13A to 13D, FIGS. 14A to 14D, andFIGS. 15A to 15D. Note that examples of the bendable or foldable deviceinclude a display device, a light-emitting device, an input device, andthe like. Examples of the input device include a touch sensor, a touchpanel, and the like. Examples of the light-emitting device include anorganic EL panel, a lighting device, and the like. Examples of thedisplay device include a light-emitting device, an organic EL panel, aliquid crystal display device, and the like. Note that a function of theinput device such as a touch sensor may be provided in a display deviceor a light-emitting device. For example, a counter substrate (e.g., asubstrate not provided with a transistor) of a display device or alight-emitting device may be provided with a touch sensor.Alternatively, an element substrate (e.g., a substrate provided with atransistor) of the display device or the light-emitting device may beprovided with a touch sensor. Still alternatively, the counter substrateand the element substrate of the display device or the light-emittingdevice may be provided with touch sensors.

First, a separation layer 703 is formed over a formation substrate 701,and a layer 705 to be separated (hereinafter referred to as a layer 705)is formed over the separation layer 703 (FIG. 13A). In addition, aseparation layer 723 is formed over a formation substrate 721, and alayer 725 to be separated (hereinafter referred to as a layer 725) isformed over the separation layer 723 (FIG. 13B).

For example, when a tungsten film is used as the separation layer, atungsten oxide film can be formed between the layer to be separated andthe tungsten film by an oxidation method such as performing plasmatreatment on the tungsten film with a gas containing oxygen such as N₂O,annealing the tungsten film in a gas atmosphere containing oxygen, orforming a tungsten film by sputtering or the like in a gas atmospherecontaining oxygen.

At the time of a separating and transferring process of the tungstenoxide film, it is preferable that the tungsten oxide film includetungsten oxide with a composition in which the ratio of oxygen totungsten is lower than 3. In the case where tungsten oxide isW_(n)O(_(3n-1)) or W_(n)O(_(3n-2)), which is a homologous series, shearis easily caused by heating because there is a crystal optical shearplane therein. Forming the tungsten oxide film by N₂O plasma treatmentenables separation of the layer to be separated from the substrate witha weak force.

Alternatively, the tungsten oxide film can be directly formed withoutforming the tungsten film. For example, only the tungsten oxide film maybe formed as the separation layer by performing plasma treatment on asufficiently thin tungsten film with a gas containing oxygen, annealinga sufficiently thin tungsten film in a gas atmosphere containing oxygen,or forming the oxide tungsten film by sputtering or the like in a gasatmosphere containing oxygen.

When the separation is caused at the interface between the tungsten filmand the tungsten oxide film or within the tungsten oxide film, thetungsten oxide film is left on the side of the layer to be separated insome cases. The left tungsten oxide film might adversely affect theproperties of a transistor. Thus, a step of removing the left tungstenoxide film is preferably performed after the step of separating theseparation layer and the layer to be separated. Note that the abovemethod for separation from the substrate does not necessarily requireN₂O plasma treatment, so that the step of removing the tungsten oxidefilm can also be omitted. In that case, the device can be fabricatedmore simply.

In one embodiment of the present invention, a tungsten film with athickness of greater than or equal to 0.1 nm and less than 200 nm isformed over the substrate.

As the separation layer, a film containing molybdenum, titanium,vanadium, tantalum, silicon, aluminum, or an alloy thereof can be used,besides a tungsten film. Furthermore, it is also possible to use a stackof such a film and its oxide film. The separation layer is not limitedto an inorganic film, and an organic film such as polyimide may be used.

In the case of using an organic resin for the separation layer, aprocess temperature needs to be lower than or equal to 350° C. whenlow-temperature polysilicon is used as an active layer of a transistor.Thus, dehydrogenation baking for silicon crystallization, hydrogenationfor termination of defects in silicon, or activation of a doped regioncannot be performed sufficiently, so that the performance of thetransistor is limited. On the other hand, in the case of using aninorganic film, the process temperature is not limited to 350° C., andexcellent characteristics of a transistor can be obtained.

In the case of using the organic resin for the separation layer, theorganic resin or a functional element is damaged in some cases by laserirradiation at the time of crystallization; thus, it is preferable touse an inorganic film for the separation layer because such a problem isnot caused.

Furthermore, in the case of using the organic resin for the separationlayer, the organic resin shrinks by laser irradiation for separating theresin and contact failure is caused in the contact portion of theterminal of an FPC or the like, which makes it difficult for functionalelements with many terminals in a high-definition display, or the liketo be separated and transferred with high yield. In the case of using aninorganic film for the separation layer, there is no such limitation,and functional elements with many terminals of a high-definition displayor the like can be separated and transferred with high yield.

In the method for separating a functional element from a substrate ofone embodiment of the present invention, an insulating layer and atransistor can be formed over a formation substrate at a temperature oflower than or equal to 600° C. In that case, high-temperaturepolysilicon can be used for a semiconductor layer. With use of aconventional production line for high-temperature polysilicon, asemiconductor device with a high operation speed, a high gas barrierproperty, and high reliability can be mass-produced. In that case, withuse of the insulating layer and the transistor formed through a processat 600° C. or lower, insulating layers having an excellent gas barrierproperty formed at a temperature of lower than or equal to 600° C. canbe provided above and below an organic EL element. Accordingly, entry ofimpurities such as moisture into the organic EL element or thesemiconductor layer can be suppressed, whereby an extraordinarilyreliable light-emitting device can be obtained as compared with the caseof using the organic resin or the like as the separation layer.

Alternatively, the insulating layer and the transistor can be formedover the formation substrate at 500° C. or lower. In that case,low-temperature polysilicon or an oxide semiconductor can be used forthe semiconductor layer, and mass production is possible with use of aconventional production line for low-temperature polysilicon. Also inthat case, with use of the insulating layer and the transistor formedthrough the process at 500° C. or lower, insulating layers having anexcellent gas barrier property formed at 500° C. or lower can beprovided above and below the organic EL element. Accordingly, the entryof impurities such as moisture into the organic EL element or thesemiconductor layer is suppressed, whereby a highly reliablelight-emitting device can be obtained as compared with the case of usingthe organic resin as the separation layer.

Alternatively, the insulating layer and the transistor can be formedover the formation substrate at 400° C. or lower. In that case,amorphous silicon or an oxide semiconductor can be used for thesemiconductor layer, and mass production is possible with use of aconventional production line for amorphous silicon. Also in that case,with use of the insulating layer and the transistor formed through theprocess at 400° C. or lower, insulating layers having an excellent gasbarrier property formed at 400° C. or lower can be provided above andbelow the organic EL element. Accordingly, the entry of impurities suchas moisture into the organic EL element or the semiconductor layer canbe suppressed, whereby a reliable light-emitting device can be obtainedas compared with the case of using the organic resin or the like as theseparation layer.

Next, the formation substrate 701 and the formation substrate 721 areattached to each other by using a bonding layer 707 and a frame-likebonding layer 711 so that the surfaces over which the layers to beseparated are formed face each other, and then, the bonding layer 707and the frame-like bonding layer 711 are cured (FIG. 13C). Here, theframe-like bonding layer 711 and the bonding layer 707 in a regionsurrounded by the frame-like bonding layer 711 are provided over thelayer 725 and after that, the formation substrate 701 and the formationsubstrate 721 face each other and are attached to each other.

Note that the formation substrate 701 and the formation substrate 721are preferably attached to each other in a reduced-pressure atmosphere.

Note that although FIG. 13C illustrates the case where the separationlayer 703 and the separation layer 723 are different in size, separationlayers having the same size as illustrated in FIG. 13D may be used.

The bonding layer 707 is provided to overlap with the separation layer703, the layer 705, the layer 725, and the separation layer 723. Then,edges of the bonding layer 707 are preferably positioned inside an areabetween at least edges of either the separation layer 703 or theseparation layer 723 (the separation layer which is desirably separatedfrom the substrate first). Accordingly, strong adhesion between theformation substrate 701 and the formation substrate 721 can besuppressed; thus, a decrease in yield of a subsequent separating processcan be suppressed.

Next, a first trigger 741 for separation from the substrate is formed bylaser irradiation (FIGS. 14A and 14B).

Either the formation substrate 701 or the formation substrate 721 may beseparated first. In the case where the separation layers differ in size,a substrate over which a larger separation layer is formed may beseparated first or a substrate over which a smaller separation layer isformed may be separated first. In the case where an element such as asemiconductor element, a light-emitting element, or a display element isformed over only one of the substrates, the substrate on the side wherethe element is formed may be separated first or the other substrate maybe separated first. Here, an example in which the formation substrate701 is separated first is described.

A region where the bonding layer 707 in a cured state or the frame-likebonding layer 711 in a cured state, the layer 705, and the separationlayer 703 overlap with one another is irradiated with laser light. Here,the bonding layer 707 is in a cured state and the frame-like bondinglayer 711 is not in a cured state, and the bonding layer 707 in a curedstate is irradiated with laser light (see an arrow P3 in FIG. 14A).

Part of the layer 705 is removed; thus, the first trigger 741 forseparation from the substrate can be formed (see a region surrounded bya dashed line in FIG. 14B). At this time, not only the layer 705 butalso the separation layer 703, the bonding layer 707, or another layerincluded in the layer 705 may be partly removed.

It is preferred that laser light irradiation be performed from the sideof the substrate provided with the separation layer that is desirablyseparated. In the case where a region where the separation layer 703 andthe separation layer 723 overlap with each other is irradiated withlaser light, the formation substrate 701 and the separation layer 703can be selectively separated by cracking only the layer 705 of thelayers 705 and 725 (see the region surrounded by the dotted line in FIG.14B).

When a trigger for separation from the substrate is formed in both thelayer 705 on the separation layer 703 side and the layer 725 on theseparation layer 723 side in the case where the region where theseparation layer 703 and the separation layer 723 overlap with eachother is irradiated with laser light, it might be difficult toselectively separate one of the formation substrates. Therefore, laserlight irradiation conditions are restricted so that only one of thelayers to be separated is cracked, in some cases. The method for formingthe first trigger 741 for separation from the substrate is not limitedto laser light irradiation, and the first trigger 741 may be formed by asharp knife such as a cutter.

Then, the layer 705 and the formation substrate 701 are separated fromeach other from the first trigger 741 for separation from the substrate(FIGS. 14C and 14D). Consequently, the layer 705 can be transferred fromthe formation substrate 701 to the formation substrate 721.

The layer 705 that is separated from the formation substrate 701 in thestep in FIG. 14D is attached to a substrate 731 with a bonding layer733, and the bonding layer 733 is cured (FIG. 15A).

Next, a second trigger 743 for separation from the substrate is formedby a sharp knife such as a cutter (FIGS. 15B and 15C). The method forforming the second trigger 743 for separation from the substrate is notlimited to a sharp knife such as a cutter, and the second trigger 743may be formed by laser light irradiation or the like.

In the case where the substrate 731 on the side where the separationlayer 723 is not provided can be cut by a knife or the like, a cut maybe made in the substrate 731, the bonding layer 733, and the layer 725(see arrows P5 in FIG. 15B). Consequently, part of the layer 725 can beremoved; thus, the second trigger 743 for separation from the substratecan be formed (see a region surrounded by a dashed line in FIG. 15C).

In the case where there is a region in which the formation substrate 721and the substrate 731 are attached to each other using the bonding layer733 without overlapping with the separation layer 723 as illustrated inFIGS. 15B and 15C, yield of a subsequent process of separation from thesubstrate might be decreased depending on the degree of adhesion betweenthe formation substrate 721 and the substrate 731. Therefore, a cut ispreferably made in a frame shape in a region where the bonding layer 733in a cured state and the separation layer 723 overlap with each other toform the second trigger 743 for separation from the substrate in theform of a solid line. This can improve the yield of the process ofseparation from the substrate.

Then, the layer 725 and the formation substrate 721 are separated fromeach other from the second trigger 743 for separation from the substrate(FIG. 15D), so that the layer 725 can be transferred from the formationsubstrate 721 to the substrate 731.

For example, in the case where the tungsten oxide film, which is tightlyanchored by N₂O plasma or the like is formed on an inorganic film suchas a tungsten film, adhesion can be relatively high in deposition. Afterthat, when a separation trigger is formed, cleavage occurs therefrom,whereby a layer to be separated can be easily separated from a formationsubstrate and transferred to another substrate.

The formation substrate 721 and the layer 725 may be separated from eachother by filling the interface between the separation layer 723 and thelayer 725 with a liquid such as water. A portion between the separationlayer 723 and the layer 725 absorbs a liquid through a capillarityaction. Accordingly, an adverse effect on the functional element such asan FET included in the layer 725 due to static electricity caused at thetime of separation from the substrate (e.g., a phenomenon in which asemiconductor element is damaged by static electricity) can besuppressed.

When a bond of M-O-W (M represents a given element) is divided byapplication of physical force, a liquid is absorbed into the gap,whereby the bond becomes bonds of M-OH HO-W with a longer bond distanceand the separation is promoted.

Note that a liquid may be sprayed in an atomized form or in a vaporizedform. Examples of liquids include pure water, an organic solvent, aneutral, alkali, or acid aqueous solution, and an aqueous solution inwhich a salt is dissolved.

The temperature of the liquid and the substrate at the time of dynamicseparation is set in the range from room temperature to 120° C., andpreferably set to 60° C. to 90° C.

In the method for separation from a substrate in one embodiment of thepresent invention described above, separation of the formation substrateis performed in such a manner that the second trigger 743 for separationfrom the substrate is formed by a sharp knife or the like so that theseparation layer and the layer to be separated are made in a separablestate. This can improve the yield of the process of separation from thesubstrate.

In addition, bonding of a substrate with which a device is to be formedcan be performed after the following procedure: a pair of formationsubstrates each provided with a layer to be separated are attached toeach other and the formation substrates are individually separated.Therefore, formation substrates having low flexibility can be attachedto each other when the layers to be separated are attached to eachother, whereby alignment accuracy at the time of attachment can beimproved compared with the case where flexible substrates are attachedto each other.

In the method for separation from a substrate in one embodiment of thepresent invention, a layer to be separated over an oxide layer includesa first layer and a second layer from which hydrogen is released by heattreatment. In addition, WO₃ in the oxide layer can be reduced byhydrogen released by heat treatment from the layer to be separated, sothat the oxide layer can have a high WO₂ content. Consequently,separation from a substrate can be facilitated.

This embodiment can be implemented in appropriate combinations with anyof the other embodiments and examples described in this specification.

This application is based on Japanese Patent Application serial no.2013-249677 filed with Japan Patent Office on Dec. 2, 2013, the entirecontents of which are hereby incorporated by reference.

What is claimed is:
 1. A display device comprising: a display panel; anda first housing, a second housing, and a third housing, wherein, whenthe display device is folded, a display surface of the display panelfaces inward, wherein the display panel comprises: a first regionoverlapping with the first housing; a second region overlapping with thesecond housing; a third region between the first region and the secondregion; a fourth region overlapping with the first region; and a fifthregion between the first region and the fourth region, wherein, when thedisplay device is folded, each of the third region and the fifth regionhas a curved region, wherein, when the display device is not folded, thefifth region has a curved region, wherein, when the display device isnot folded, the third housing has a region overlapping with each of thefirst region, the second region, and the third region, and wherein thethird housing is positioned between the first region and the fourthregion.
 2. The display device according to claim 1, wherein the fourthregion has a terminal portion.
 3. The display device according to claim1, wherein, when the display device is folded, a center of curvature ofthe third region is positioned on a display surface side of the displaydevice.
 4. The display device according to claim 1, wherein, when thedisplay device is folded, a center of curvature of the fifth region ispositioned on a back surface of a display surface side of the displaydevice.